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this is information on a product in full production. june 2013 docid022331 rev 11 1/20 20 mp34dt01 mems audio sensor omnidire ctional digital microphone datasheet - production data features ? single supply voltage ? low power consumption ? 120 dbspl acoustic overload point ? 63 db signal-to-noise ratio ? omnidirectional sensitivity ? ?26 dbfs sensitivity ? pdm output ? hclga package ? top-port design ? smd-compliant ? emi-shielded ?ecopack ? , rohs, and ?green? compliant applications ? mobile terminals ? laptop and notebook computers ? portable media players ? voip ? speech recognition ? a/v elearning devices ? gaming and virtual reality input devices ? digital still and video cameras ? antitheft systems description the mp34dt01 is an ultra-compact, low-power, omnidirectional, digital mems microphone built with a capacitive sensing element and an ic interface. the sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors. the ic interface is manufactured using a cmos process that allows designing a dedicated circuit able to provide a digital signal externally in pdm format. the mp34dt01 has an acoustic overload point of 120 dbspl with a 63 db si gnal-to-noise ratio and ?26 dbfs sensitivity. the mp34dt01 is available in a top-port, smd- compliant, emi-shielded package and is guaranteed to operate over an extended temperature range from -40 c to +85 c. hclga (3 x 4 x 1 mm) 4ld table 1. device summary order codes temperature range [c] package packing mp34dt01 -40 to +85 hclga (3 x 4 x 1 mm) 4ld tray MP34DT01TR -40 to +85 hclga (3 x 4 x 1 mm) 4ld tape and reel www.st.com
contents mp34dt01 2/20 docid022331 rev 11 contents 1 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 acoustic and electrical specificat ions . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 carrier tape mechanical specif ications . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 process recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 7 functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 7.1 l/r channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 8 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
docid022331 rev 11 3/20 mp34dt01 list of tables list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 table 3. acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 4. distortion specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 5. timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 6. frequency response mask for digital microphones . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 7. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 8. l/r channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 9. recommended soldering pr ofile limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 10. hclga (3 x 4 x 1 mm) 4-lead package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 table 11. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
list of figures mp34dt01 4/20 docid022331 rev 11 list of figures figure 1. pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. timing waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 3. frequency response and mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 4. carrier tape without microphone-top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 5. carrier tape with microphone-top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 6. recommended picking area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 7. recommended picker design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 8. recommended soldering profile limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 figure 9. hclga (3 x 4 x 1 mm) 4-lead package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 10. land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
docid022331 rev 11 5/20 mp34dt01 pin description 1 pin description figure 1. pin connections table 2. pin description pin # pin name function 1 vdd power supply 2 lr left/right channel selection 3 clk synchronization input clock 4 dout left/right pdm data output 5 (ground ring) gnd 0 v supply (bottom view) 1 2 3 4 lr vdd clk dout 5 gnd am045273v1 (top view)
acoustic and electrical specifications mp34dt01 6/20 docid022331 rev 11 2 acoustic and electrical specifications 2.1 acoustic and elect rical characteristics the values listed in the table below are specified for vdd = 1.8 v, clock = 2.4 mhz, t = 25 c, unless otherwise noted. table 3. acoustic and electrical characteristics symbol parameter test condition min. typ. (1) 1. typical specificatio ns are not guaranteed. max. unit vdd supply voltage 1.64 1.8 3.6 v idd current consumption in normal mode mean value 0.6 ma iddpdn current consumption in power-down mode (2) 2. input clock in static mode. 20 a scc short-circuit current 1 10 ma aop acoustic overload point 120 dbspl so sensitivity -29 -26 -23 dbfs snr signal-to-noise ratio a-weighted at 1 khz, 1 pa 63 db psr power supply rejection guaranteed by design -70 dbfs clock input clock frequency (3) 3. duty cycle: min = 40% max = 60%. 1 2.4 3.25 mhz ton turn-on time (4) 4. time from the first clock edge to valid output data. guaranteed by design 10 ms to p operating te mperature range -40 +85 c v iol low level logic input/output voltage i out = 1 ma -0.3 0.35xvdd v v ioh high level logic input/output voltage i out = 1 ma 0.65xvdd vdd+0.3 v table 4. distortion specifications parameter test condition value distortion 100 dbspl (50 hz - 4 khz) < 1% thd + n distortion 115 dbspl (1 khz) < 5% thd + n
docid022331 rev 11 7/20 mp34dt01 acoustic and electrical specifications 2.2 timing characteristics figure 2. timing waveforms table 5. timing characteristics parameter descrip tion min. max. unit f clk clock frequency for normal mode 1 3.25 mhz f pd clock frequency for power-down mode 0.23 mhz t clk clock period for normal mode 308 1000 ns t r,en data enabled on data line, l/r pin = 1 18 (1) 1. from design simulations ns t r,dis data disabled on data line, l/r pin = 1 16 (1) ns t l,en data enabled on data line, l/r pin = 0 18 (1) ns t l,dis data disabled on data line, l/r pin = 0 16 (1) ns high z high z high z high z t l,en r,dis r,en t l,dis t t t clk am045165v1 clk pdm r pdm l
acoustic and electrical specifications mp34dt01 8/20 docid022331 rev 11 2.3 frequency response figure 3. frequency response and mask table 6. frequency response mask for digital microphones frequency / hz (1) 1. at t = 20 c and acoustic stimulus = 1 pa (94 db spl) lower limit upper limit unit 100...4000 -2 +2 dbr 1khz 4000...10000 -2 +4 dbr 1khz
docid022331 rev 11 9/20 mp34dt01 carrier tape mechanical specifications 3 carrier tape mechanical specifications figure 4. carrier tape without microphone-top view figure 5. carrier tape with microphone-top view
process recommendations mp34dt01 10/20 docid022331 rev 11 4 process recommendations to ensure a consistent manufacturing process it is strongly advised to comply with following recommendations: ? the recommended pick-up area for the mp34dt01 package must be defined using the worst case (ie. no device alignment during picking process). this area has been defined considering all the toleranc es of the components involved (reel, package, sound inlet). picker tolerance shall be considered as well. ? to prevent damage to the mems membrane or incorrect pick-up and placement, do not pick up the component on the inlet area ? for the package outline please refer to figure 5 . nozzle shape, size, and placement accuracy are the other key fact ors to consider when deciding on the coordinates for the picking. ? device alignment before picking is highly recommended. ? a vacuum force greater than 7 psi must be avoided ? 1 kpa = 0.145 psi (lb/in2) = 0.0102 kgf/cm2 = 0.0098 atm ? all the recommended dimensions (device safe pick area) do not include the pick and place equipment tolerances figure 6. recommended picking area
docid022331 rev 11 11/20 mp34dt01 process recommendations to have a safe pick-up "by design", st it is strongly advised to an ad hoc nozzle. following picker ensures that the holes for the vacuum and the air blow are always away from the porthole of the device (4 vacuum ports located at the corner of the device). the suggested nozzle has also a recess, in the form of a cross, that guarantees the porthole to be always left at atmos pheric pressure. by us ing the suggested no zzle the membrane will not suffer any sudden air disturbances during the picking or placing of the devices in the tape and reel. figure 7. recommended picker design
sensing element mp34dt01 12/20 docid022331 rev 11 5 sensing element the sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silic on chip. this sensor transduces the sound pressure into the changes of coupled capacity between those two plates. omron corporation supplies this element for stmicroelectronics.
docid022331 rev 11 13/20 mp34dt01 absolute maximum ratings 6 absolute maximum ratings stresses above those listed as ?absolute ma ximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device under these conditions is not implied. ex posure to maximum rating conditions for extended periods may affect device reliability. table 7. absolute maximum ratings symbol ratings maximum value unit vdd supply voltage -0.3 to 6 v vin input voltage on any control pin -0.3 to vdd +0.3 v t stg storage temperature range -40 to +125 c esd electrostatic discharge protection 2 (hbm) kv this device is sensitive to mechanical shock, improper handling can cause permanent damage to the part. this device is esd-sensitive, improper han dling can cause permanent damage to the part.
functionality mp34dt01 14/20 docid022331 rev 11 7 functionality 7.1 l/r channel selection the l/r digital pad lets the user select the dout signal pattern as shown in table 8 . the l/r pin must be connected to vdd or gnd. table 8. l/r channel selection l/r clk low clk high gnd data valid high impedance vdd high impedance data valid
docid022331 rev 11 15/20 mp34dt01 package mechanical data 8 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. soldering information the hclga (3 x 4) 4ld package is also co mpliant with the rohs and ?green? standards and is qualified for soldering heat resistance according to jedec j-std-020. landing pattern and soldering recommendations are available at www.st.com . figure 8. recommended soldering profile limits table 9. recommended soldering profile limits description parameter pb free average ramp rate t l to t p 3 c/sec max preheat minimum temperature maximum temperature time (t smin to t smax ) t smin t smax t s 150 c 200 c 60 sec to 120 sec ramp-up rate t smax to t l time maintained above liquids temperature liquids temperature t l t l 60 sec to 150 sec 217 c peak temperature t p 260 c max time within 5 c of actual peak temperature 20 sec to 40 sec ramp-down rate 6 c/sec max time 25 c (t25 c) to peak temperature 8 minutes max t25c to peak ramp-down ramp-up t s preheat t l t p critical zone t l to t p t smax t smin time t p t l temperature 30 60 90 120 150 180 210 240 270 300 330 360 390 am045166v1
package mechanical data mp34dt01 16/20 docid022331 rev 11 figure 9. hclga (3 x 4 x 1 mm) 4-lead package outline top view bottom view [e1]/2 [ e 1 ] / 2 e1 e 1 d1 d 1 [e2]/2 [ e 2 ] / 2 e2 e 2 e1 e 1 e2 e 2 d2 d 2 4xr2 4 x r 2 l1 l 1 l1 l 1 1 2 3 4 pin 1 indicator p i n 1 i n d i c a t o r a c seating plane s e a t i n g p l a n e d eee e e e c ccc c c c c f d e r1 sound port r 1 s o u n d p o r t d3 d 3 e3 e 3 a b d aaa a a a c 2x 2 x d aaa a a a c 2x 2 x a1 a 1 3 6 6 6 6 4 8053274_e
docid022331 rev 11 17/20 mp34dt01 package mechanical data table 10. hclga (3 x 4 x 1 mm) 4-lead package dimensions symbol mm min. typ. max. a 0.90 1.00 1.10 a1 0.00 - 0.05 b 0.35 0.45 0.50 d 3.90 4.00 4.10 d1 3.05 3.10 3.15 d2 3.75 3.80 3.85 d3 0.30 0.50 0.70 e 2.90 3.00 3.10 e1 2.05 2.10 2.15 e2 2.75 2.80 2.85 e3 -0.20 0.00 0.20 e1 1.30 1.35 1.40 e2 0.80 0.85 0.90 h 0.25 0.30 0.35 l 0.90 0.95 1.00 l1 - 0.10 - n4 r1 0.30 0.40 0.50 r2 - 0.40 - aaa 0.15 ccc 0.10 eee 0.08
package mechanical data mp34dt01 18/20 docid022331 rev 11 figure 10. land pattern gnd gnd gnd gnd dout vdd clk lr 1.30 2.30 0.35 0.40 0.95 0.35 pad + solder paste 0.85 0.85
docid022331 rev 11 19/20 mp34dt01 revision history 9 revision history table 11. document revision history date revision changes 06-oct-2011 1 initial release 18-nov-2011 2 removed ?stereo? from title, features , and description 29-nov-2011 3 updated features and description 04-jan-2012 4 updated figure : added so limits to table 3: acoustic and electrical characteristics minor textual updates 23-mar-2012 5 updated figure 9: hclga (3 x 4 x 1 mm) 4-lead package outline pin 1 indicator removed from top view of package on page 1 and figure 1: pin connections updated table 10: hclga (3 x 4 x 1 mm) 4-lead package dimensions 06-apr-2012 6 updated maximum supply voltage in table 3: acoustic and electrical characteristics 07-may-2012 7 added v iol , v ioh to table 3: acoustic and electrical characteristics 18-may-2012 8 updated table 5: timing characteristics 05-jul-2012 9 added section 5: sensing element added figure 10: land pattern updated temperature range to -40 to +85 c throughout datasheet 21-feb-2013 10 updated dimension t2 in ta ble 10 07-jun-2013 11 updated - figure 3: frequency response and mask - table 6: frequency response mask for digital microphones - hclga mechanical data figure 9 on page 16 and table 10 on page 17 added - section 3: carrier tape mechanical specifications - section 4: process recommendations
mp34dt01 20/20 docid022331 rev 11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not authorized for use in weapons. nor are st products designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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